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Reliability of Rohs-Compliant 2d and 3d ic Interconnects (Electronic Engineering)
John Lau (Author)
·
Mcgraw-Hill Publ.Comp.
· Hardcover
Reliability of Rohs-Compliant 2d and 3d ic Interconnects (Electronic Engineering) - John Lau
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Origin: U.S.A.
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Synopsis "Reliability of Rohs-Compliant 2d and 3d ic Interconnects (Electronic Engineering)"
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.Proven 2D and 3D IC lead-free interconnect reliability techniquesReliability of RoHS-Compliant 2D and 3D IC Interconnects offers tested solutions to reliability problems in lead-free interconnects for PCB assembly, conventional IC packaging, 3D IC packaging, and 3D IC integration. This authoritative guide presents the latest cutting-edge reliability methods and data for electronic manufacturing services (EMS) on second-level interconnects, packaging assembly on first-level interconnects, and 3D IC integration on microbumps and through-silicon-via (TSV) interposers. Design reliable 2D and 3D IC interconnects in RoHS-compliant projects using the detailed information in this practical resource.Covers reliability of:2D and 3D IC lead-free interconnectsCCGA, PBGA, WLP, PQFP, flip-chip, lead-free SAC solder jointsLead-free (SACX) solder jointsLow-temperature lead-free (SnBiAg) solder jointsSolder joints with voids, high strain rate, and high ramp rateVCSEL and LED lead-free interconnects3D LED and 3D MEMS with TSVsChip-to-wafer (C2W) bonding and lead-free interconnectsWafer-to-wafer (W2W) bonding and lead-free interconnects3D IC chip stacking with low-temperature bondingTSV interposers and lead-free interconnectsElectromigration of lead-free microbumps for 3D IC integration
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The book is written in English.
The binding of this edition is Hardcover.
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