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chemical-mechanical planarization of semiconductor materials
M. R. Oliver
(Illustrated by)
·
Springer
· Paperback
chemical-mechanical planarization of semiconductor materials - Oliver, M. R.
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Synopsis "chemical-mechanical planarization of semiconductor materials"
Chemical Mechanical Planarization (CMP) is fast becoming the established technology for removing unwanted materials after etching from the semiconductor chip surface, as well as for other steps in the manufacturing process. This volume is a comprehensive review of CMP technology in state-of-the-art semiconductor manufacturing. There are detailed discussions of all aspects of the technology, for both dielectrics and metals. The state of polishing models and their relation to experimental results are covered, as are polishing tools and consumables. The leading edge issues of damascene and new dielectrics as well as slurryless technology are also developed.
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The book is written in English.
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