Share
Area Array Package Design
Ken Gilleo (Author)
·
Mcgraw-Hill
· Paperback
Area Array Package Design - Ken Gilleo
Choose the list to add your product or create one New List
✓ Product added successfully to the Wishlist.
Go to My Wishlists
Origin: U.S.A.
(Import costs included in the price)
It will be shipped from our warehouse between
Tuesday, May 28 and
Thursday, June 13.
You will receive it anywhere in United Kingdom between 1 and 3 business days after shipment.
Synopsis "Area Array Package Design"
This engineering reference covers the most important new techniques in electronic packaging: flip chip, BGA, and MEMs. Written by a team of world-class professionals and researchers, Area Array Package Design includes vital information necessary for the design of cutting-edge electronics products.
- 0% (0)
- 0% (0)
- 0% (0)
- 0% (0)
- 0% (0)
All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.
✓ Producto agregado correctamente al carro, Ir a Pagar.
