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Area Array Packaging Processes
Ken Gilleo (Author)
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Mcgraw-Hill
· Paperback
Area Array Packaging Processes - Ken Gilleo
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Origin: U.S.A.
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Synopsis "Area Array Packaging Processes"
This engineering reference covers the most important solders and materials in modern electronic packaging. Written by a team of world-class professionals and researchers, Area Array Packaging Materials includes vital information necessary for the design of cutting-edge electronics products.
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All books in our catalog are Original.
The book is written in English.
The binding of this edition is Paperback.
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