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Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems)
Juan Cepeda-Rizo; Jeremiah Gayle; Joshua Ravich (Author)
·
Crc Press
· Hardcover
Thermal and Structural Electronic Packaging Analysis for Space and Extreme Environments (Resilience and Sustainability in Civil, Mechanical, Aerospace and Manufacturing Engineering Systems) - Juan Cepeda-Rizo; Jeremiah Gayle; Joshua Ravich
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